Broadening the capability of the most versatile 3D X-ray microscopy instrument
The ZEISS Xradia Versa 500-series of 3D X-ray microscopes delivers large-sample, high throughput scanning with best-in-class image quality. Combined with the high resolution of ZEISS Xradia Versa X-ray microscopes (XRM), the new ZEISS FPX flat panel extension enhances imaging flexibility and creates workflow efficiencies with an all-in-one system for industrial development and academic research.
ZEISS Xradia Versa with FPX enables engineering, development and researchers to scout large samples 2-5x faster to identify a region of interest (ROI), and then zoom to image areas at high resolution with the exclusive ZEISS Xradia Versa RaaD dual magnification microscope objectives that enable resolution at a distance. ZEISS FPX extends the ability for ZEISS Xradia Versa XRM to achieve full field of view, whole-sample imaging, up to five inches in diameter for samples 10x greater in volume with higher throughput.
Howard Marks, Director of Technology Operations at the Silicon Failure Analysis Lab at NVIDIA, the world leader in visual computing solutions, said, “At NVIDIA, our goal is to achieve excellence and the highest quality of FA possible for customers. We expected ZEISS FPX to deliver the excellence that allows us to continue to be tops in our field and it did. We are now able to quickly and effectively perform inspection, analysis and root cause determination in minimal time with our new ZEISS Xradia Versa with FPX. The additional capabilities give us improved response times to achieve the quality goals that keep our products the best in the world.”
Lourens Steger, Senior Vice President and General Manager of Carl Zeiss X-ray Microscopy, Inc., commented, “The addition of ZEISS FPX is further proof of our commitment to versatility and continued investment protection with ZEISS Xradia 3D X-ray microscopes. We have taken what is already the most-versatile platform and made it even more flexible for large sample imaging, now with production-level throughput.”
ZEISS Xradia Versa with FPX offers unique capabilities in a number of research areas:
In the electronics, automotive, and medical industries, product development requires process optimization, design compliance verification and failure analysis at the system, module and component level. Now, with ZEISS FPX, fine details may be imaged seamlessly from system to components with an all-in-one tool to enhance efficiency. Engineers may complete these tasks by scanning an entire intact device, such as a smartphone, then zoom to a processor or battery module, and finally to the interconnect or material structure, respectively.
In the oil and gas industry, ZEISS Xradia Versa with FPX enables highly effective imaging of large samples, including 4” diameter whole core. Integrated Scout-and-Zoom workflows offer non-invasive proscriptive sampling using interior tomography as an alternative to mechanical sampling to achieve characterization of heterogeneity at a level not previously possible. ZEISS Xradia Versa with FPX enables high throughput multiscale imaging, characterization and modeling (from 4” core to sub-micron scale) of reservoir samples, all on a single system.
Materials scientists in a central imaging facility benefit from the higher throughput and increased operating range enabled by ZEISS FPX, expanding the capacity of ZEISS Xradia Versa to accommodate samples from a broad array of both academic and industrial users. Using the familiar Scout-and-Zoom workflow, researchers will be able to nondestructively locate regions of interest on significantly larger samples, providing intelligent navigation for high resolution interior tomography.
The increased sample size and Scout-and-Zoom capabilities provide researchers in life sciences with the capability to image entire intact specimens without physical sectioning, improving the richness and scope of data while reducing the acquisition time. This capability will also be appreciated by museum researchers and historians who will benefit from the large field of view that now matches the requirements for the analysis of meteorites, fossils and artifacts that cannot be sub-sampled due to their precious nature.
The ZEISS FPX flat panel extension is available for order with new ZEISS Xradia 510 Versa and ZEISS Xradia 520 Versa systems and as a field upgrade for all 500-series ZEISS Xradia Versa 3D X-ray microscopes. Interested parties may contact their ZEISS sales representative today.
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